Beyond Liquid Cooling

ThermodynamicArchitecturefor AI Silicon

Coeffici integrates precision microfluidics, magnetocaloric entropy layers, and multi-physics orchestration to extend compute density for the AI era.

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Unified Magneto-Thermal Stack

We don't just move heat;
we manage thermodynamics

Our unified stack integrates precision microfluidics, magnetocaloric materials, and active field control through three integrated layers working in harmony.

01

Precision Microfluidics

Hardware Layer

Deterministic microchannel geometry engineered for hotspot targeting and minimized pressure drop. Each channel is optimized for extreme thermal density.

Layer Depth25%
02

Magnetocaloric Buffering

Entropy Layer

Low-hysteresis, room-temperature magnetocaloric materials embedded as dynamic entropy reservoirs. Actively absorbs transient heat spikes.

Layer Depth50%
03

Active Field Cycling

Field Layer

Actively cycled magnetic fields (0–1.5 T) engineered for integration feasibility and EMI safety. Triggers entropy absorption and release.

Layer Depth75%
04

EntropyOS Orchestration

Control Layer

Real-time thermodynamic control engine that dynamically controls field cycling to regulate entropy absorption and release. The brain of the system.

Layer Depth100%

Four layers. One unified system. Infinite thermal control.

Coeffici Stack
Core Technology

Engineered for extreme density

Every component of our stack is precision-engineered for AI silicon. From microchannel geometry to field modulation algorithms.

Microfluidics

Channel Width50-200μm
Aspect RatioUp to 10:1
Flow Rate0.1-10 L/min
Pressure Drop< 5% ΔP

Magnetocaloric

MaterialGd-Si-Ge alloys
ΔT adiabatic2-3 K/T
Hysteresis< 1 K
Cycle Life10⁶ cycles

Field Control

Field Range0-1.5 T
Ramp Rate10 T/s
Uniformity±2%
EMI Shielding> 60 dB

What makes us different

Deterministic Flow Architecture

Unlike conventional liquid cooling that relies on turbulent flow, our microfluidic channels are precision-engineered for laminar flow with predictable thermal impedance.

Active Entropy Management

Traditional cooling is passive. Our magnetocaloric layers actively absorb and release thermal energy on demand, creating a thermal buffer that smooths transient heat spikes.

Real-Time Field Modulation

Static magnetic fields are inefficient. Our actively cycled fields respond to thermal load in real-time, optimizing energy efficiency while maintaining cooling capacity.

Four layers. One unified system. Infinite thermal control.

Coeffici Stack
EntropyOS Platform

The brain of the system

EntropyOS is a real-time thermodynamic control engine that orchestrates field cycling, monitors thermal state, and optimizes cooling strategies.

Real-Time Control

Sub-millisecond response to thermal load changes with predictive algorithms.

Multi-Physics Simulation

Coupled thermal, magnetic, and fluid dynamics modeling for accurate predictions.

Predictive Analytics

AI-powered forecasting of thermal behavior to optimize cooling strategies.

Our Vision
"The next generation of AI scaling will not be limited by transistor count or memory bandwidth. It will be limited by the laws of thermodynamics."

Coeffici is building the entropy infrastructure required to sustain the future of global compute. We believe that mastering thermodynamics at the chip scale is the key to unlocking the next decade of AI advancement.

Get in Touch

Let's build the future together

Ready to extend compute density beyond conventional limits? Get in touch with our team.

Send us a message

Location

San Francisco, CA

Working Hours

Monday - Friday: 9:00 AM - 6:00 PM PST

We typically respond within 24 hours

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